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EMIF04-EAR02M8
4-line IPADTM EMI filter and ESD protection for headset Features

Lead-free package High attenuation: -30 dB at 900 MHz Low cut-off frequencies: 60 MHz for speaker lines High current capability: 50 mA per line Very low PCB space consumption: 1.5 mm x 1.7 mm Very thin package: 0.6 mm maximum High efficiency in ESD suppression IEC6 1000-4-2 level 4 High reliability offered by monolithic integration Figure 1. Pin configuration (bottom side)
MIC_P_Int
Micro QFN 8 leads
MIC_P_Ext
Complies with following standards:
EAR_Ext EAR_Ext
GND
MIC_N_Ext
MIC_N_Int EAR_Int EAR_Int
IEC 61000-4-2 level 4 input pins - 15 kV (air discharge) - 8 kV (contact discharge)
Applications
Figure 2.
Equivalent circuit
R C
MIC
Mobile phones
L_MIC
Description
The EMIF04-EAR02M8 chip is a highly integrated device designed to suppress EMI/RFI noise for headset mobile phone. The new LC architecture on the speaker lines provides a high attenuation value maintaining a very low serial resistance. The 8-lead micro-QFN package offers the possibility to integrate the whole function in a very small PCB space. Additionally, this filter includes ESD protection circuitry, which prevents damage to the protected device when subjected to ESD surges up 30 kV.
R C
MIC
L_MIC
L C
EAR
L_EAR
L C
EAR
L_EAR
TM: IPAD is a trademark of STMicroelectronics
March 2009
Rev 1
1/12
www.st.com 12
Characteristics
EMIF04-EAR02M8
1
Characteristics
Table 1.
Symbol VPP IEAR Tj Tstg ESD IEC 61000-4-2 air discharge contact discharge Maximum rms current per channel Operating junction temperature Storage temperature range
Absolute maximum ratings (Tamb = 25 C)
Parameter Value 30 30 50 -30 to 125 -55 to +150 Unit kV mA C C
Figure 3.
Electrical symbols and parameters
VBR Breakdown voltage VRM Stand-off voltage IRM Leakage current @ VRM VBR VRM IRM
I
V IRM VRM VBR
Table 2.
Symbol VBR IRM LEAR RL RMIC CL_EAR CL_MIC Fc_EAR Fc_MIC
Electrical characteristics (Tamb = 25 C)
Test conditions IR = 1 mA VRM = 3 V 1.5 Parasitic resistance of inductor LEAR 54 VR = 0 V DC, 1 MHz VR = 0 V DC, 1 MHz Cut-off frequency earphone line: ZSOURCE = ZLOAD = 50 Cut-off frequency microphone line: ZSOURCE = ZLOAD = 50 84 60 0.30 68 105 76 60 70 0.6 82 126 92 Min. 7 100 Typ. Max. Unit V nA nH pF pF MHz MHz
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EMIF04-EAR02M8
Characteristics
Figure 4.
0 -5 -10 -15 -20 -25 -30 -35 -40 -45 -50 100k
S21 attenuation measurement
Figure 5.
0 -10 -20 -30
Analog cross talk measurements
dB
dB
MIC_N MIC_P EAR_R EAR_L F (Hz)
-40 -50 -60 -70
MIC_N - MIC_P EAR_L - MIC_P
100k 1M 10M 100M
F (Hz)
1G
1M
10M
100M
1G
Figure 6.
ESD response to IEC 61000-4-2 (+15 kV air discharge) on one MIC input (Vin) and on one MIC output
Figure 7.
ESD response to IEC 61000-4-2 (-15 kV air discharge) on one MIC input (Vin) and on one MIC output
IN
5.00 V/div
5.00 V/div
IN
5.00 V/div
OUT
5.00 V/div 100 ns/div
OUT
100 ns/div
Figure 8.
ESD response to IEC 61000-4-2 (+15 kV air discharge) on one EAR input (Vin) and on one EAR output
Figure 9.
ESD response to IEC 61000-4-2 (-15 kV air discharge) on one EAR input (Vin) and on one EAR output
5.00 V/div
IN
5.00 V/div
IN
OUT
5.00 V/div 100 ns/div
5.00 V/div
OUT
100 ns/div
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Characteristics
EMIF04-EAR02M8
Figure 10. Relative line capacitance variation versus applied voltage
C/C0
Figure 11. Total harmonic distortion with noise: MIC lines, R = 10 k
0 THD + N (dB)
1.0 MIC lines EAR lines 0.8
-50
0.6 0
1
2
3
4
VR(V) 5
-100 100 1k
F (Hz) 10 k
Figure 12. Total harmonic distortion with noise: MIC lines, R = 32
0 THD + N (dB)
Figure 13. Total harmonic distortion with noise: EAR lines, R = 32
0 THD + N (dB)
-50
-50
F (Hz) -100 100 F (Hz) 1k 10 k -100 100 1k 10 k
Figure 14. Total harmonic distortion with noise: EAR lines, R = 8
0 THD + N (dB)
-50
-100 100 1k
F (Hz) 10 k
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EMIF04-EAR02M8
Application information
2
Application information
Figure 15. Example of application scheme using EMIF04-EAR02M8
EMIF04-EAR02M8
VDD
MIC_P MIC_P
MIC_P_Ext MIC_P_Int MIC_N_Ext MIC_N_Int
MIC_P
MIC_N MIC_N
MIC_N
EAR_R EAR_R
EAR_Ext
GND
EAR_Int
EAR_R
EAR_L EAR_L
EAR_Ext
EAR_Int
EAR_L
Audio sub-system Cable Headset connector
3
Ordering information scheme
Figure 16. Ordering information scheme
EMIF EMI Filter Number of lines Information xxx = application zz = version Package Mx = Micro QFN x leads yy xxx zz Mx
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Package information
EMIF04-EAR02M8
4
Package information
Epoxy meets UL94, V0
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK(R) packages, depending on their level of environmental compliance. ECOPACK(R) specifications, grade definitions and product status are available at: www.st.com. ECOPACK(R) is an ST trademark. Table 3. Micro QFN dimensions
Dimensions
D
N
Ref.
Millimeters Min. Typ. 0.55 0.02 0.18 1.70 1.3 1.50 0.20 0.40 0.20 0.25 0.30 0.35 0.008 Max. 0.60 0.05 0.25 1.75 1.4 1.55 0.30 Min.
Inches Typ. Max.
E
A A1 b
0.50 0.00 0.15 1.65 1.15 1.45 0.05
0.020 0.022 0.024 0.000 0.001 0.002 0.006 0.007 0.001 0.067 0.045 0.051 0.055 0.059 0.002 0.008 0.012 0.016
1
2
A A1
1
D
D2
2
D2
L E2 k
E E2 e
N
b e
k L
0.010 0.012 0.014
Figure 17. Footprint
0.40 0.20
Figure 18. Marking
Dot: Pin1 identification XX = Marking
0.60 0.32 0.26 2.10
XX
1.32
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EMIF04-EAR02M8 Figure 19. Tape and reel specification
0.25 0.05
Package information
1.95 0.1
8.0 0.3
KA
KA
KA
1.75 0.1 0.70 0.05
4.0 0.1
All dimensions in mm
User direction of unreeling
Note:
Product marking may be rotated by 90 for assembly plant differentiation. In no case should this product marking be used to orient the component for its placement on a PCB. Only pin 1 mark is to be used for this purpose.
3.5 - 0.1
1.75 0.1
2.0 0.05
4.0 0.1
O 1.55 0.05
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Recommendation on PCB assembly
EMIF04-EAR02M8
5
5.1
Recommendation on PCB assembly
Stencil opening design
1. General recommendation on stencil opening design a) Stencil opening dimensions: L (Length), W (Width), T (Thickness).
Figure 20. Stencil opening dimensions
L
T
W
b)
General design rule Stencil thickness (T) = 75 ~ 125 m W Aspect Ratio = ---- 1.5 T LxW Aspect Area = --------------------------- 0.66 2T ( L + W )
2.
Reference design a) b) c) Stencil opening thickness: 100 m Stencil opening for central exposed pad: Opening to footprint ratio is 50%. Stencil opening for leads: Opening to footprint ratio is 90%.
Figure 21. Recommended stencil window position
5 m 5 m 15 m
T=100 m
600 m 570 m
190 m 15 m 200 m
1320 m 50 m
260 m
160 m
1080 m 50 m 120 m
Footprint
Stencil window Footprint
120 m
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EMIF04-EAR02M8
Recommendation on PCB assembly
5.2
Solder paste
1. 2. 3. 4. Halide-free flux qualification ROL0 according to ANSI/J-STD-004. "No clean" solder paste is recommended. Offers a high tack force to resist component movement during high speed Solder paste with fine particles: powder particle size is 20-45 m.
5.3
Placement
1. 2. 3. 4. Manual positioning is not recommended. It is recommended to use the lead recognition capabilities of the placement system, not the outline centering Standard tolerance of 0.05 mm is recommended. 3.5 N placement force is recommended. Too much placement force can lead to squeezed out solder paste and cause solder joints to short. Too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. To improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool. For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools.
5. 6.
5.4
PCB design preference
1. 2. To control the solder paste amount, the closed via is recommended instead of open vias. The position of tracks and open vias in the solder area should be well balanced. The symmetrical layout is recommended, in case any tilt phenomena caused by asymmetrical solder paste amount due to the solder flow away.
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Recommendation on PCB assembly
EMIF04-EAR02M8
5.5
Reflow profile
Figure 22. ST ECOPACK(R) recommended soldering reflow profile for PCB mounting
Temperature (C)
260C max 255C 220C 180C 125 C
2C/s recommended 2C/s recommended 6C/s max 6C/s max
3C/s max 3C/s max
0 0 1 2 3 4 5
10-30 sec 90 to 150 sec 90 sec max
6
7
Time (min)
Note:
Minimize air convection currents in the reflow oven to avoid component movement.
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EMIF04-EAR02M8
Ordering information
6
Ordering information
Table 4. Ordering information
Marking KA(1) Package Micro QFN Weight 3.8 mg Base qty 3000 Delivery mode Tape and reel
Order code EMIF04-EAR02M8
1. The marking can be rotated by 90 to differentiate assembly location
7
Revision history
Table 5.
Date 24-Mar-2009
Document revision history
Revision 1 Initial release Changes
11/12
EMIF04-EAR02M8
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